Shenzhen Pingchen Semiconductor Technology Co., Ltd. was established in 2015. It is a high-tech enterprise dedicated to the research and development, production, sales and service of semiconductor packaging equipment. The company introduces foreign advanced technology and develops a series of fully automatic die bonding machines suitable for SMA, SMB, SOD, TO, IGBT, COB, Mini Bridge, Circuit, BGA, IC and other package types.
Pingchen Semiconductor has an experienced software and hardware R & D team that has been in the industry for more than ten years. It has won national high-tech enterprises and double software enterprises, and has obtained more than 20 invention patents and software works. There are more than ten industry-university-research projects and high-tech achievement transformation projects. The products have covered the Pearl River Delta, the Yangtze River Delta, and the western region. It is a leading semiconductor packaging equipment company in China!
In addition, the company has long been operating ASM / KS / DISCO / KAIJO and other international brands to import used semiconductor packaging equipment. It has rich resources and is one of the largest spot suppliers in the industry.
Pingchen Semiconductor adheres to the foundation of innovation research and development, market demand-oriented, customer service as the center, and deeply cultivates the semiconductor industry. When you choose Pingchen, you choose a win-win situation!